Project Milestones and Deliverables

 

T0 + 1
  •  M1 (Kick-off meeting minutes)

T0 + 3
  • D1.1 (Management Guidelines)
  • D7.1 (Project website)

T0 + 6
  • D7.2 (First Newsletter)

T0 + 9
  • D4.1 (Delivery of the CEA TDK for Organic CMOS technology)
  • D7.3 (Plan for using and disseminating foreground)

T0 + 12
  • D2.1 (Report on best performing free standing OSSCs)
  • D7.2 (Second Newsletter)
  • M2 (Identification of the best performing OSSCs)

T0 + 15
  • D3.1 (Report on high performance amplifier unit)

T0 + 16
  • D7.4 (Report on raising public participation and awareness)

T0 + 18
  • D2.2 (Report on the best performing OSSCs/substrates and/or OSSCs/electrodes combinations)
  • D3.2 (Report on the implementation and characterization of the PLA structure)
  • D4.2 (Delivery of the PLA and STA TDK)
  • D5.1 (Report on the radiation hardness and of the degradation assessment of each component)
  • D6.1 (Identification of the LEGO building blocks structure needed for each specific application)
  • D7.3b (Plan for using and disseminating foreground including information on website access)
  • D7.8b (Plan for the exploitation of the results and its upgrade)
  • M3 (Assessment of the photonic PLA sensor unit)

T0 + 20
  • D7.5 (i-FLEXIS summer school, including dissemination material such as flyer and posters)
  • D7.6 (i-FLEXIS workshops/symposia (EMRS), including dissemination material)

T0 + 21
  • D3.3 (Report on the implementation and characterization of the STA structure)
  • M4 (Assessment of the photonic STA sensor unit)

T0 + 22
  • D4.3 (Delivery of the Oxide CMOS TDK)

T0 + 24
  • D3.4 (Report on the implementation and characterization of the final pixelized system architecture)
  • D5.2 (Quantitative assessment of the photonic sensor unit radiation hardness and degradation specifications)
  • M5 (Design and implementation of the integrated i-FLEXIS single pixel)

T0 + 26
  • D6.2 - Design and Integration of the i-FLEXIS system into the IDtag application. Report on the test vehicle characterization and technical specifications
  • M6 - i-FLEXIS technology test vehicle for application 1: luggage ID tags

T0 + 28
  • D2.3 - Report on the characterization of inkjet printed OSSCs photoresponse

T0 + 30
  • D2.4 - Protocol for pre-industrial inks formulations for OSSCs direct printing processes
  • D7.2 (Fifth Newsletter)

T0 + 32
  • D6.3 - Design and Integration of the i-FLEXIS system into the HDsensor (Health radiation dosimeter) application. Report on the test vehicle characterization and technical specification
  • D7.4 - Report on raising public participation and awareness

T0 + 34
  • D6.4 - Report on the validation and future industrial feasibility of the IDTag test vehicle
  • D7.7 - Roadmap of the results of i-FLEXIS project

T0 + 36
  • D7.6 - i-FLEXIS workshops/symposia (EMRS), including dissemination material
  • D7.5 - i-FLEXIS summer school, including dissemination material such as flyer and posters
  • D4.4 - Modelling of the final system architectures, derived from WP6
  • D5.3 - Report on the validation of the i-FLEXIS systems (developed in WP6) in terms of radiation hardness and degradation specifications
  • D6.6 - Report on the validation and future industrial feasibility of the HDsensor test vehicle. (i) Health radiation dosimeter, (ii) Bone density analyser
  • D7.2 - Sixth Newsletter
  • D7.3 - Plan for using and disseminating foreground
  • D7.8 - Plan for the exploitation of the results and its upgrade

T0 + 36 + 2 months
  • D1.4 - Final Management Report
  • D1.5 - Final Report